Application declaration
1. The text name and graphic logo of Hongmao Semiconductor in the specifications, manuals and documents are the registered trademarks of Shenzhen Hongmao Semiconductor Co., LTD.
2. Hongmo Semiconductor reserves the right to further explain the improvement of reliability, function and design of all products in the specifications, manuals and documents.
3. Hongmao Semiconductor reserves the right to modify specifications, manuals and documents without prior notice.
4. Specifications, manuals, and documents will be updated without further notice. Please confirm whether the specifications, manuals, and documents in your hand are the latest version before use.
5. Hongmo Semiconductor does not assume any responsibility arising from the use and use of the contents, products or circuits referred to in this specification, manual or document.
6. All contents, parameters, circuits and drawings mentioned in specifications, manuals and documents are intended only for reference design instructions, and HMC does not guarantee or represent that these applications can be applied to any product design without further modification.
7. Our products are not specifically designed for use in life support, life-saving and any areas where use may cause harm, injury or even death to individuals due to failure or other reasons. In the event that the products of Helmore are used in the above fields, even if these are caused by Helmore's negligence in the design and manufacture of the products, the User shall indemnify all costs, losses, reasonable personal injury or death directly or indirectly arising out of attorney's fees, and the User warrants that HELmore had nothing to do with such matters.